TSMC, UMC ramping wafer production capacity in China
Josephine Lien, Taipei; Steve Shen, DIGITIMES [Monday 22 September 2014]
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are ramping up the wafer production capacity of their 8-inch fabs in China to cope with rising demand, according to industry sources.
TSMC plans to ramp up the capacity of its 8-inch fab in Shanghai, which focuses on production of high-voltage process products, MCUs, smartcards, embedded SoCs, to 110,000 units a month from 90,000 units currently.
Meanwhile, UMC plans to expand the production capacity of Hejian Technology, its subsidiary in China, to 60,000 units a month from the current 49,000 units. The 8-inch fab focuses on production of LCD driver and power management (PWM) ICs.
TSMC China ranked as the sixth largest semiconductor firm in China with revenues totaling CNY3.53 billion (US$575.07 million) in 2013, while Hejain took the ninth position with revenues of CNY1.37 billion, according to data compiled by Shanghai Integrated Circuit Research and Development (ICRD) Center.
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